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Degate flash die inserts-
Degate flash die inserts
Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.
Semiconductor transfer mold-
Semiconductor transfer mold
Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...
Mold Chase-
Mold Chase
Mold chase could use the normally or use the vacuum chase for the molding to ensure the high quality of molding process.
MGP mold-
MGP mold
Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA
MGP robot molding system-
MGP robot molding system
Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application
Degate flash die inserts-
Degate flash die inserts
Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.
Semiconductor transfer mold-
Semiconductor transfer mold
Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...
Mold Chase-
Mold Chase
Mold chase could use the normally or use the vacuum chase for the molding to ensure the high quality of molding process.
MGP mold-
MGP mold
Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA
MGP robot molding system-
MGP robot molding system
Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application
Degate flash die inserts-
Degate flash die inserts
Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.
Semiconductor transfer mold-
Semiconductor transfer mold
Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...
Mold Chase-
Mold Chase
Mold chase could use the normally or use the vacuum chase for the molding to ensure the high quality of molding process.
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