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Degate flash die inserts-

Degate flash die inserts

Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.

Semiconductor transfer mold-

Semiconductor transfer mold

Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...

Mold Chase-

Mold Chase

Mold chase could use the normally or use the vacuum chase for the molding to ensure the high quality of molding process.

MGP mold-

MGP mold

Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA