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Degate flash die inserts-

Degate flash die inserts

Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.

2_0005_1 (49).jpg

Semiconductor transfer mold-

Semiconductor transfer mold

Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...

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Transfer mold chase-

Transfer mold chase

Product Details A single set of mold boxes for plastic sealing molds. Taijin not only specializes in manufacturing plastic sealing molds, but also plastic sealing mold parts. Using imported raw materials, utilizing imported advanced equipments for ma...

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MGP mold-

MGP mold

Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA

MGP robot molding system.jpg

MGP robot molding system-

MGP robot molding system

Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application

1 (16).JPG

Degate flash die inserts-

Degate flash die inserts

Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.

2_0005_1 (49).jpg

Semiconductor transfer mold-

Semiconductor transfer mold

Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...

1 (19).JPG

Transfer mold chase-

Transfer mold chase

Product Details A single set of mold boxes for plastic sealing molds. Taijin not only specializes in manufacturing plastic sealing molds, but also plastic sealing mold parts. Using imported raw materials, utilizing imported advanced equipments for ma...

1 (6).JPG

MGP mold-

MGP mold

Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA

MGP robot molding system.jpg

MGP robot molding system-

MGP robot molding system

Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application

1 (16).JPG

Degate flash die inserts-

Degate flash die inserts

Precision tooling spare parts,which could use the materials of requirement and doing the treatment for different materials and usage to ensure the quality.

2_0005_1 (49).jpg

Semiconductor transfer mold-

Semiconductor transfer mold

Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has l...

1 (19).JPG

Transfer mold chase-

Transfer mold chase

Product Details A single set of mold boxes for plastic sealing molds. Taijin not only specializes in manufacturing plastic sealing molds, but also plastic sealing mold parts. Using imported raw materials, utilizing imported advanced equipments for ma...