Focus on Auto molding system, semiconductor transfer molding system ,Trim and Form Singulation System, Leadframe transfer molding,for different package from TO, SOP, TSSOP, DIP, SOT, SOD, SMA, SMB, SMC, QFN, QFP and BGA.
Focus on Auto molding system, semiconductor transfer molding system ,Trim and Form Singulation System, Leadframe transfer molding,for different package from TO, SOP, TSSOP, DIP, SOT, SOD, SMA, SMB, SMC, QFN, QFP and BGA.
Widely use high precision imported top brand machines in this industry, The whole processing of more than 15 years experiences engineers and technicians from the designing, fabricating,assambly,molding trial, Could customerize the machine to support customers special requirement, Install and maintance on site, training at customer side, remote on line assistance for the solution when needed.
R&D advantage
We have more than 50 research and development technicians, and the company has multiple technology patents. We have been awarded the titles of National High tech Enterprise. Our core technology is at the forefront of this industry to make the high UPH and stable comstructure of the machine designing to make the machine have shorten down time!
Manufacturing advantage
The company has advanced manufacturing and processing capabilities in China with the high of high accuracy machine, and has a number of CNC processing equipment with numerical control precision. At the same time, it also has a group of automation design experts and a team of skilled and ingenious engineers for the electrical systems and software debugs!
Quality advantage
Taijin semiconductor quality control department has a perfect quality control in process with the quality inspection standards of all aspects before and after assembly, which provides a powerful guarantee to produce high-quality plastic packaging equipment in time.
Service advantage
Master the machine in every details professionally! Understand the user problems immediately and solve them in time. The machines module is designed and can be replaced. It can be adjusted and upgraded, and can be supported by expert engineers for long-term on-site commissioning, installation and maintenance, training and other work.
2010丨14 years of semiconductor chip packaging machine
Guangdong Taijin Semiconductor Technology Co., Ltd. was established in September 2010, located in Shangjiao Community, Chang'an Town, Dongguan City, China. Right now have two production base in Jiaxing and Dongguan (Headquarter), with total 280 employees of more than 200 sets of machine delivery to different area across the world. lt is a high technology manufacturer in Leadframe transfer molding, semiconductor chip packaging machine process, also as encapsulation process include: Auto Molding System, Semiconductor transfer molding system,Trim& amp; Form System, MGP Mold,Trim& amp; Form tools, leadframe stamp tools, auto degating system, singulation system and so on. We have continuously developed and innovate new mold structures, and develop high-precision, high-yield, long-life molds to help our customer to for...
An enterprise of R& D, production, manufacturing and sales of semiconductor lead frame molds and (integrated circuit ) package process equipment! Include auto molding systems,degating machine, the trim form system! And we are open our mind for the customers visiting, and attending the fairs, and even pay a visiting to our customers!