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IC Lead Frame Mold SOP16L-12R

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IC Lead Frame toolings for QFP-64-

IC Lead Frame toolings for QFP-64

Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimension.We could advise our solution to ensure the quality and the quantity requirement.To find a balance and then bring a totally lowest cost for customer to ensure their competitive device price.

IC LeadFrame stamp tools SOP8-12R-

IC LeadFrame stamp tools SOP8-12R

Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantit...

IC Lead Frame Mold SOP020-8P-

IC Lead Frame Mold SOP020-8P

Product Details 01 Superior technology We utilize precision equipment and a professional technical team to improve the consistency of mold dimensions 02 Considerate service Manufacturers supply high quality and low price, large quantities from the be...

Leadframe stamping toolings-

Leadframe stamping toolings

Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA