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Semi-auto Molding System-
Semi-auto Molding System
Semi-auto molding machine is used for the trial or the R&D process of the New package which is used for the Epoxy molding compound. It could manage of 8 stage of pressure force controlling ,and help to analysis the details of the processing.
Automatic IC Molding System-
Automatic IC Molding System
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
Auto molding system(Auto Transfer Molding)-
Auto molding system(Auto Transfer Molding)
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
Auto molding system-
Auto molding system
Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA
MGP robot molding system-
MGP robot molding system
Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application
Semi-auto Molding System-
Semi-auto Molding System
Semi-auto molding machine is used for the trial or the R&D process of the New package which is used for the Epoxy molding compound. It could manage of 8 stage of pressure force controlling ,and help to analysis the details of the processing.
Automatic IC Molding System-
Automatic IC Molding System
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
Auto molding system(Auto Transfer Molding)-
Auto molding system(Auto Transfer Molding)
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
Auto molding system-
Auto molding system
Customization: Available Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement Certification: CE, EPA
MGP robot molding system-
MGP robot molding system
Application: Suitable for automatic onloading and unloading of products in molding processes. Parameters: Equipment Model: RS104 Single Press Cycle Time: 150S (based on 100S press clamp time and 10S mold opening and closing time) Equipment Power: 22KW Equipment Voltage: Three-phase five-wire AC 380V, 50-60Hz Equipment Air Pressure: 0.4-0.6MPa Control System: Keyence PLC Operating System: 15-inch color touchscreen + buttons Loading Structure: Magazine loading + 4-axis robot flexible loading Collection Structure: 4-axis robot + magazine collection Safety Protection System: Equipped with leakage protection device, emergency stop button and safety door Equipment Dimensions: 3440x2200x1850mm (reference dimensions) Optional Functions: AOI visual inspection after degate application
Semi-auto Molding System-
Semi-auto Molding System
Semi-auto molding machine is used for the trial or the R&D process of the New package which is used for the Epoxy molding compound. It could manage of 8 stage of pressure force controlling ,and help to analysis the details of the processing.
Automatic IC Molding System-
Automatic IC Molding System
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
Auto molding system(Auto Transfer Molding)-
Auto molding system(Auto Transfer Molding)
Main parameters: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2...
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